ከፍተኛ ንፅህና ኳርትዝ ዋፈር ጀልባ

The high purity quartz wafer boat is made of synthetic quartz sand by arc melting process, which has very low thermal expansion coefficient and excellent thermal shock resistance to ensure that there is no risk of deformation or cracking in the rapid rise and fall process. The surface is precisely polished to reduce particle pollution, suitable for the harsh and clean environment in semiconductor manufacturing. The product supports customized size (length 100-500mm, number of slots 2-24) and adapts to various wafer sizes (4 "-12").

1. Core material characteristics

Arc melting process of synthetic quartz sand

Using ultra-high purity quartz sand (SiO₂ purity ≥99.999%), amorphous quartz glass structure is formed by arc melting technology. This process eliminates grain boundary defects, significantly improves material uniformity, and ensures that the waferboats remain stable at high temperatures (≤1250 °C).

Ultra low coefficient of thermal expansion

The thermal expansion factor is as low as 5.5×10^-7K^-1(20-300 °C), allowing almost no size change during rapid temperature rise and fall (e.g., 200 °C /min in semiconductor processes), avoiding microcracks or deformation due to thermal stress.

Thermal shock resistance optimization

Through the gradient annealing process, the thermal shock tolerance temperature difference can reach 1200℃→ room temperature for more than 100 cycles without cracking, meeting the strict requirements of ion implantation, rapid annealing and other processes.

2. Precision machining and surface treatment

Nanoscale polishing technology

The surface roughness is controlled at Ra≤0.2μm, and chemical mechanical polishing (CMP) combined with plasma etching is used to effectively reduce the adsorption of particles, and the cleanliness is in line with SEMI F47 standard (particle number ≤10 /[ኢሜል የተጠበቀ]μm).

Anti-fouling coating (optional)

The silicon carbide or silicon nitride surface coating can be customized to reduce the friction coefficient of the wafer contact surface (μ≤0.05), reducing the risk of scratches and metal ion migration.

ፈጣን ዝርዝር:

1. Other names: Quartz boat, wafer bracket.

2. Application: Carrying and transmission in high temperature process of semiconductor wafer, suitable for diffusion, oxidation and other processes.

3. Core parameters: purity ≥99.99%, maximum temperature resistance 1200℃, thermal expansion coefficient 5.5×10^-7/℃.

1. Semiconductor wafer processing (diffusion furnace, oxidation furnace).

2. Photovoltaic industry silicon wafer processing.

3. Laboratory grade high temperature experimental wafer bearing.

Purity industry leading, metal impurity content <1ppm.

Long service life (≥500 high temperature cycles).

Support non-standard customization, short delivery cycle.