የሲኤምፒ ማጽጃ ጠለፋ

CMP (Chemical Mechanical Planarization) polishing abrasive is a key material in the fields of semiconductor manufacturing, optical glass, integrated circuits, etc., and achieve nano-level surface flattening through the synergistic effect of chemical corrosion and mechanical grinding.

መተግበሪያ:

CMP polishing abrasives are crucial key materials in the field of integrated circuit manufacturing and can be used in integrated circuit ILD, semiconductor monocrystalline silicon wafers, semiconductor silicon carbide, integrated circuit shallow trench isolation (STI), integrated circuit polysilicon (Poly - Si), integrated circuit metals and metal barrier layers.

ሊሰጡ የሚችሉ አገልግሎቶች፡

የደንበኛ መተግበሪያ ሁኔታ ትንተና፣ የማዛመጃ ቁሳቁሶች፣ የቴክኒክ ችግር መፍታት።

የድርጅቱ ህይወት ታሪክ:

ሴሚክስላብ ሁለት ላቦራቶሪዎች ያሉት ሲሆን የ20 ዓመት የቁሳቁስ ልምድ ያላቸው ባለሙያዎች ቡድን ሲሆን የምርምር እና የልማት፣ የፈተና እና የማረጋገጫ ችሎታዎች አሉት።

Performance Indicators for Ultra-High Purity Series Products

ዋና የማመልከቻ መስኮች

የኢኮሎጂካል ሰንሰለት ማረጋገጫ ማረጋገጫ

Semixlab CMP polishing abrasives meet the semiconductor industry certification and have passed the ISO 14001/45001/9001 certification

የተለመደው የማመልከቻ ሂደት

Raw material → Abrasive Synthesis (Surface modification)→ Slurry Formulation (Filtration/PH adjustment)→ CMP polishing (EPD control)→ Post-Clean → Inspection (AFM/KLA)→ Data Feedback Optimization

Through process parameter optimization, Semixlab CMP polishing abrasive has achieved breakthrough progress in the field of domestic high-end semiconductor integrated circuit, gradually replaced imports in the semiconductor market, and has been successfully applied to the production and manufacturing of LCD, OLED and other display panels. If you need to obtain detailed technical white papers or arrange sample testing, please contact our technical support team.

Semixlab CMP polishing abrasive core advantages

a.Freely adjustable particle diameter and degree of particle aggregation;

b.Monodisperse particles with uniform particle size distribution;

c.Stable dispersion system;

d.Large-scale production capability with minimal batch-to-batch variation;

e.Highly stable, resistant to agglomeration and sedimentation.

Semixlab CMP polishing abrasive shops